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The status and application of LED encapsulation adhesives
As the jewel in the crown, LED products have been widely used in indications, backlight, display, luminaire and other applications. The application fields cover consumer electronics, automotive, advertising, transportation, sports, entertainment, construction and other all-round areas. As an upstream industry, LED encapsulation is the top priority, which determines the service life and the degree of light transmission.
LED封裝膠概況/LED Encapsulant Overview
LED(Light Emtting Diode)全稱發光二極管，是一種可以將電能轉化為光能的半導體材料。
LED (Light Emitting Diode) stands for light-emitting diode, which is a semiconductor material that can convert electrical energy into light energy.
LED encapsulation technology is currently mainly developing in four directions: high luminous efficiency, high reliability, high heat dissipation capacity and thinning. The main highlights are silicon-based LED, chip-on-board (COB) technology, polycrystalline LED chip encapsulation, high-voltage LED, etc. In these encapsulation forms, the corresponding materials are also different.
LED encapsulation adhesive is also called LED encapsulant or LED adhesive. Previously, the main component of LED encapsulant was ordinary epoxy resin, but because of its weak heat and UV resistance, the gel easily turns yellow and affects the light transmission effect. Cycloaliphatic epoxy resin has high temperature resistance, strong UV resistance and excellent anti-aging properties, etc. Thus it has replaced ordinary epoxy resin in high-end product applications.
LED封裝膠發展歷程/LED Encapsulant History
1960s-1980s 以GaP、GaN為基礎的LED研究獲得突破GaP, GaN-based LED research has achieved breakthroughs
1993 LED全彩化由日亞化工實現 LED full color is realized by Nichia Chemical.
1998 SMD LED封裝工藝出現SMD LED encapsulation technique appeared.
2008 出現COB封裝工藝 COB encapsulation technique appeared.
2013 出現基于Flip Chip的無引線封裝 Flip Chip-based leadless encapsulation appeared.
LED封裝膠產業分析/LED Encapsulant Industry Analysis
上游 Upstream Industry
Encapsulation materials: organic silicon, epoxy resin, PCT
LED芯片制造 LED chip manufacture
中游 Midstream Industry
LED封裝 LED encapsulation
下游 Downstream Industry
液晶背光源 LCD backlight
LED顯示屏 LED display
LED車燈 LED car lights
景觀燈飾 Landscape lighting
特殊照明 Special lighting
交通信號燈 Traffic lights
LED封裝膠行業壁壘/LED Encapsulant Industry Barriers
技術壁壘 Technical barriers
LED encapsulant production involves encapsulation material, optical performance testing, automated technology and control.
資金壁壘 Financial barriers
The purchase and operation of LED encapsulant production line and equipment require a lot of capital.
客戶壁壘 Customer barriers
In a downstream industry, customers are concentrated in LED display, backlight, automotive and other fields, where there are strict supplier certification system, long certification cycle, as well as strict requirements on the company's supply capacity, capital capacity and R&D capacity.
退出壁壘 Exit barriers
Large investment in early production lines and equipment for the LED encapsulation industry.
LED封裝膠市場分析/LED Encapsulant Market Analysis
中國LED照明市場規模 China LED lighting market size
China is the largest manufacturer of LED lighting products. With the domestic LED lighting market penetration rate quickly climbed to more than 70%, LED lighting has become a necessity in lighting application. The domestic LED lighting market size shows a faster growth momentum than the global average. According to statistics, the output value of China's LED lighting market increased from 259.6 billion yuan in 2015 to 415.5 billion yuan in 2018, with a compound annual growth rate of 16.97 percent, higher than the global average. China's LED lighting market is expected to reach 590 billion yuan by 2021. It is still expected to maintain a compound annual growth rate of more than 12% in 2019-2021.
Picture 1: Chinese LED lighting market size and growth trend from 2016 to 2021
Picture 2: Market share of global LED encapsulantsupply source from 2016 to 2019 (unit: %)
Chinese mainland has undertaken global industrial shift in the past 10 years. According to LEDinside statistics, in 2019 Chinese mainland market share on the global LED encapsulant supply source reached 71%. Overseas production capacity is mainly focused on vehicle lighting and other relatively high-end market demand. General lighting, landscape lighting, LED display, backlighting and other traditional applications mostly come from Chinese mainland suppliers.
At present, the midstream encapsulant industry is a relatively mature link in the development of China's LED industry. Domestic enterprises play the scale advantages. Since 2010 they have begun to enter a period of high-speed development. After 2015 they gradually leveled off, but they still maintain an annual growth rate of more than 10%. According to the forecast data of Gaogong LED, the output value of domestic LED encapsulation will exceed 100 billion yuan in 2018, while it is expected to reach 128.8 billion yuan in 2020.
LED封裝膠行業發展趨勢/LED Encapsulant Industry Development Trend
There is still a certain gap in research and application when comparing the domestic LED encapsulating materials with that of foreign countries. Although the high refractive index encapsulating materials have entered the market, they cannot be applied to high-quality LED devices due to reliability problems. The market for high-end encapsulating materials is basically monopolized by large foreign companies. Compared with foreign products, domestically developed or produced materials still have disadvantages such as low luminous flux, poor adhesion, or high water absorption. As several major foreign companies control their domestic sales of key raw materials in order to maintain their own adhesive market monopoly, domestic companies need to continuously solve the problem of independent synthesis of raw materials, break the monopoly and control of raw materials by foreign companies, and independently innovate production equipment and processes to prevent them from falling into the patent trap of foreign companies. With the promotion of the market and the investment of a large amount of corporate funds, technical problems will continue to be solved by R&D personnel, and domestic LED encapsulating materials will certainly catch up with imported encapsulating materials.
Cycloaliphatic epoxy resin is ideal for use in LED encapsulant due to its excellent processing property, good thermal stability, electrical insulation and strong UV radiation resistance. After more than ten years of experience and continuous reform and innovation, Synasia has grown into a specialized cycloaliphatic epoxy resin manufacturer with rich production experience and premium product quality. We fully understand that long term business is highly dependable on customer trust. Synasia will continue providing high quality products and excellent services to thank you for your support!
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